About to MSMP 2026
The 2026 International Conference on Material Structures and Mechanical Properties (MSMP 2026) will bring together researchers and professionals from materials science, solid mechanics, and advanced manufacturing to discuss emerging developments in material design and mechanical performance. As advanced materials play an increasingly important role in aerospace, energy systems, transportation, and intelligent manufacturing, understanding their strength, toughness, durability, and service reliability has become essential. The conference will focus on structural materials, mechanical behavior, microstructural regulation, fatigue and fracture analysis, composite materials, characterization technologies, and digital materials development. MSMP 2026 aims to establish a high-level platform for international collaboration and promote innovation in materials research and engineering applications.
IMPORTANT DATES
2026-10-06-Submission Deadline
2026-10-13-Registration Deadline
2026-10-23-Conference Date
About a week after the submission-Notification Date
RECORD
All full paper submissions to the MSMP 2026 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of MSMP 2026 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
Paper template
Please refer to the paper template for layout
Click to download
Register
All attendees must register in advance to attend the meeting
Consulting service
Submit
Please submit the full text/abstract of the paper to us through the electronic submission system
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Call For Papers
Materials Science, Material Structure, Mechanical Properties, Advanced Materials, Composite Materials, Metallic Materials, Polymer Materials, Functional Materials, Materials Processing, Fracture Mechanics, Fatigue Analysis, Structural Optimization, Material Characterization, Nanomaterials, Intelligent Materials, Materials Design, Engineering Materials, Material Reliability
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Indexing Service
Technical Sponsor
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (msmp@metting-cloud.com) if you are interested in it.
SCI Journal
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to msmp@metting-cloud.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.
Submission Portal
If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:
罗老师
TEL:157 9988 1881
QQ:2130572537
E-mail:msmp@metting-cloud.com
About Plagiarism Check
Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.