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2026 International Conference on Materials Physics, Chemistry, and Composite Materials

WELCOME TO MPCCM 2026 !

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- About to MPCCM 2026 !

The 2026 International Conference on Material Physics, Chemistry and Composite Materials (MPCCM 2026) will be held in Qingdao, China. The conference brings together research in material physics, material chemistry, composite materials, and advanced material applications. It aims to encourage communication among scientists, engineers, and graduate students working on the design, characterization, preparation, and application of new materials. Topics include material physics, material chemistry, nanomaterials, polymer composites, ceramic composites, metal matrix composites, functional materials, material characterization, interface science, and advanced material applications. Participants will discuss material structures, physical and chemical properties, preparation technologies, and performance optimization. Qingdao provides a strong industrial and research environment, supporting academic exchange and cooperation in materials science, chemical engineering, and related technological fields.

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PAPERS

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Material Physics

Design to Eliminate Waste

Land Resource Management

Rainwater Management

Water Quality Occurrence

Groundwater Management

Water Quality and Protection

Drinking Water Safety

Industrial Wastewater Treatment

Wastewater and Sludge Treatment

Integrated Water Resources Management

Watershed Assessment and Monitoring

Sludge Treatment and Reuse

On-site and Small-scale Systems

Chemistry

Agricultural Economics

Agricultural Ecology

Compound Material

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-About Plagiarism Check-

Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.

中文特别声明

出版社在论文出版前会对论文重复率进行检测,重复率大于20%的稿件将被拒绝出版;重复率不大于20%的稿件中,如有整段大面积的直接复制其他作者文章内容的情况,也会被拒绝出版。以上两种涉及抄袭的情况,一旦被出版社证实,文章将被拒绝出版,并且不退回任何会议注册费用。

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-Record-

All full paper submissions to the MPCCM 2026 could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of MPCCM 2026 will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.

-Submission Portal-

Mail Address: mccm@sub-paper.com

If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:

罗老师

WeChat/TEL:157 9988 1881

QQ:2130572537

E-mail:mccm@sub-paper.com

-Submission Guidelines-

Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to mccm@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.

Call for Reviewers

As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (mccm@sub-paper.com) if you are interested in it.

SCI JOURNAL

Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.

Technical Sponsor

Important Dates

Submission Deadline

2026-08-31

Registration Deadline

2026-09-07

Conference Date

2026-09-17

Notification Date

About a week afterthe submission

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